Description
The 830 Tie Point Breadboard is the most popular solderless breadboard size. It allows easy prototyping of large circuits without soldering, making it ideal for IoT, robotics, and embedded projects.
🔹 Features:
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830 tie points (standard full-size)
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Reusable solderless connections
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Adhesive backing for mounting
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Power rails on both sides for easy distribution
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Compatible with Arduino & Raspberry Pi
🔹 Applications:
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Arduino and IoT prototyping
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Robotics and automation projects
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Educational labs & workshops
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Large circuit testing
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